Saint-Etienne, Eric ; Reig, Bruno ; Deborgies, F. ; Ghesquiers, Jean-Pierre ; Roques, Daniel ; Le Meur, Gerard ; Cogo, B. ; Mancuso, Yves (2001) Silicon Packaging and RF Solder-free Interconnect for X-band SAR T/R Module. In: Gallium Arsenide applications symposium. Gaas 2001, 24-28 September 2001, London.
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Abstract
This paper presents recent development conducted in the area of RF packaging and interconnect technologies. An original concept of 3D silicon packaging including collective wiring process is proposed and applied to the design of an X-band T/R module demonstrator. An RF solder-less interconnect based on the CIN::APSE connecting system (CINCH TM) has been developed to address the need of vertical transition in new generation of SAR active antenna.
| Document type: | Conference or Workshop Item (Paper) |
|---|---|
| Subjects: | Area 09 - Ingegneria industriale e dell'informazione > ING-INF/01 Elettronica |
| Depositato da: | CIB Staff |
| Depositato il: | 17 Jun 2004 |
| Last modified: | 16 May 2011 13:22 |
Solo per lo Staff dell Archivio: Gestione del documento
