Lopez, D. ; Sommet, R. ; Quéré, R. (2001) Spice Thermal Subcircuit of Multifinger HBT derived from Ritz Vector reduction technique of 3D Thermal Simulation for electrothermal modeling. In: Gallium Arsenide applications symposium. Gaas 2001, 24-28 September 2001, London.
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Abstract
This paper deals with the integration of a reduced thermal model based on tree dimensional Finite Element (FE) thermal simulation into circuit simulator for accurate prediction of electrothermal behavior of power devices. The reduced thermal model based on the Ritz vectors approach is easily usable in any kind of circuit simulator because it is described by a spice format subcircuit. The model has been successfully experimented with the ADS simulator. Electrical based thermal measurements of transient temperature response have successfully validated our approach.
| Document type: | Conference or Workshop Item (Paper) |
|---|---|
| Subjects: | Area 09 - Ingegneria industriale e dell'informazione > ING-INF/01 Elettronica |
| Depositato da: | CIB Staff |
| Depositato il: | 17 Jun 2004 |
| Last modified: | 16 May 2011 13:22 |
Solo per lo Staff dell Archivio: Gestione del documento
