Maruhashi, K. ; Ito, M. ; Ikuina, K. ; Hashiguchi, T. ; Matsuda, J. ; Domon, W. ; Iwanaga, S. ; Takahashi, N. ; Ishihara, T. ; Yoshida, Y. ; Izumi, I. ; Ohata, K. (2001) 60GHZ-band flip-chip MMIC modules for IEEE1394 wireless adapters. In: Gallium Arsenide applications symposium. GAAS 2001, 24-28 september 2001, London.
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Abstract
60GHz-band 500-Mpbs transmitter and receiver multi-chip modules (MCMs) are presented, in which MMICs and a filter are mounted using flip-chip bonding technique. A multi-layer Low Temperature Co-fired Ceramic (LTCC) substrate is adopted for a package. The MCMs are directly bonded with printed wiring boards using ball grid array technique, achieving connections for signals and biasing. A developed 500-Mbps ASK transceiver exhibits an average output power of 10dBm and a minimum received power of – 55dBm. The transceiver is applied to the IEEE1394 wireless adapter which demonstrates 17-m communication distance in line of sight.
| Document type: | Conference or Workshop Item (Paper) |
|---|---|
| Subjects: | Area 09 - Ingegneria industriale e dell'informazione > ING-INF/01 Elettronica |
| Depositato da: | CIB Staff |
| Depositato il: | 17 Jun 2004 |
| Last modified: | 16 May 2011 13:28 |
Solo per lo Staff dell Archivio: Gestione del documento
