Monfraix, P. ; Adam, T. ; Lacoste, J.L. ; Drevon, C. ; Naudy, G. ; Cogo, B. ; Cazaux, Jean-Louis ; Roux, J.L. (2000) Design to reliability shielded vertical interconnection applied to microwave Chip Scale Packaging. In: Gallium Arsenide applications symposium. GAAS 2000, 2-6 october 2000, Paris.
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Abstract
This paper presents the electrical design, measurement and reliability ests of a shielded vertical interconnection dedicated to microwave solder-mount packages. Electromagnetic simulations show very good results up to 20 GHz. Test samples have been designed and manufactured. Electrical results are in accordance with the simulations with insertion loss lower than 0.1 dB up to 20 GHz for the proposed interconnection. Reliability tests of present no degradation of the after 500 thermal cycles in the [-55°C, +125°C] temperature range.
| Document type: | Conference or Workshop Item (Paper) |
|---|---|
| Subjects: | Area 09 - Ingegneria industriale e dell'informazione > ING-INF/01 Elettronica |
| Depositato da: | CIB Staff |
| Depositato il: | 17 Jun 2004 |
| Last modified: | 16 May 2011 13:26 |
Solo per lo Staff dell Archivio: Gestione del documento
