George, Sebastien ; Drevon, C. ; Cazaux, Jean-Louis (2000) Flip-chip for space applications : Bonding reliability, DC and RF results. In: Gallium Arsenide applications symposium. GAAS 2000, 2-6 october 2000, Paris.
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Abstract
This paper presents a study of flip-chip bonding for space applications. DC and mechanical test vehicles have demonstrated the reliability of the flip-chip gold-gold thermocompression bonding up to 500 thermal cycles. RF test vehicles have proved the compatibility of both coplanar and microstrip on-the-shelves MMICs with the flip-chip bonding up to 35 GHz.
| Document type: | Conference or Workshop Item (Paper) |
|---|---|
| Subjects: | Area 09 - Ingegneria industriale e dell'informazione > ING-INF/01 Elettronica |
| Depositato da: | CIB Staff |
| Depositato il: | 17 Jun 2004 |
| Last modified: | 16 May 2011 13:26 |
Solo per lo Staff dell Archivio: Gestione del documento
