Abstract

Deep RIE (Reactive Ion Etching) was developed not only for silicon but also for other materials and silicon microstructures made by the deep RIE was used as molds for making ceramic microstructures. Packaged micro mechanical sensors as pressure sensors and electrostatically levitating micro motors for gyroscope have been developed. Microprobes are fabricated for future data storage devices. Energy dissipation of resonating thin cantilever was studied for large Q factor required for highly sensitive resonating sensors. Active catheters which move like snakes in blood vessel and sensors for the catheter have been studied for the purpose of minimal invasive medicine.