Suh, Young-Ho ; Richardson, David ; Dadello, Anna ; Mahon, Simon ; Harvey, James T. (2005) A low-cost high performance GaAs MMIC package using air-cavity ceramic quad flat non-leaded package up to 40 GHz. In: Gallium Arsenide applications symposium. GAAS 2005, 3-7 ottobre 2005, Parigi.
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Abstract
A novel low-cost QFN (Quad Flat Non-Leaded) package is introduced for GaAs MMIC packaging. The air-cavity QFN package is designed and implemented with an HTCC process using Alumina substrate. To operate the package up to 40 GHz, several key methods are proposed in this paper. A low noise and a buffer amplifier are packaged for practical application examples and compared with bare die measurements to verify the QFN package performance. A maximum of 4.5 dB insertion loss degradation occurred at 40 GHz. To authors’ knowledge, this is the highest operating frequency for QFN type packages with low loss ever reported.
| Document type: | Conference or Workshop Item (Paper) |
|---|---|
| Subjects: | Area 09 - Ingegneria industriale e dell'informazione > ING-INF/01 Elettronica |
| Depositato da: | CIB Staff |
| Depositato il: | 15 Feb 2006 |
| Last modified: | 16 May 2011 13:46 |
Solo per lo Staff dell Archivio: Gestione del documento
